SHENZHEN, China – July 6, 2026 – HSTECH Automation (Shenzhen Dongke Automation Equipment Co., LTD), a leading domestic manufacturer of intelligent testing and fluid control equipment, officially launched its brand-new D450S High Speed Dispensing Machine, a fully automated vision-guided dispensing platform built to address rising demand for ultra-precise, high-throughput glue application across consumer electronics, automotive electronics, semiconductor packaging, new energy and medical device manufacturing sectors.

Against a backdrop of the global high-speed dispensing equipment market projected to hit USD 2.37 billion by 2032 with an 8.75% compound annual growth rate, electronics manufacturers face mounting pressure to upgrade traditional contact dispensers to non-contact jetting solutions to meet micro-component packaging requirements. Miniaturized PCBs, flip chips, FPC flexible circuits and 3D stack POP packaging demand consistent nanoliter-level glue output, zero overflow and fast cycle speeds—pain points fully resolved by HSTECH’s new D-series D450S dispensing system.

The D series glue dispenser features advanced industrial architecture optimized for diverse mass production environments with outstanding cost-performance ratios. Equipped with non-contact injection jet valve technology, the D450S delivers perfectly uniform dispensing trails, drastically lifting line productivity while cutting adhesive material waste by minimizing over-deposition and overflow. Combined with interchangeable multi-type dispensing valves, HSTECH provides fully customized personalized dispensing solutions tailored to unique customer process workflows.

The machine sets industry-leading micro-dispensing benchmarks with fixed performance metrics:

• Minimum dispensing dot diameter: 0.2mm
• Minimum line width: 0.25mm
• Allowable glue overflow width: 0.1mm
• Minimum dispensing volume: 2nl

This ultra-fine precision enables reliable handling of advanced packaging processes that conventional dispensers cannot support, eliminating quality defects such as insufficient glue, excessive glue and inconsistent fillet widths that reduce finished product yield.

The D450S high-speed dispensing platform supports all mainstream fluid application procedures in SMT and semiconductor factories, covering: Underfill, Precision conformal coating, Dam & Fill, COB Packaging, FPC Component Reinforcement, Pin Encapsulation, Stack POP Packaging, SMT Red Glue Process, Hot Melt Adhesive Bonding

Manufacturers deploying the D450S can consolidate multiple discrete dispensing processes onto a single inline machine, eliminating the need to purchase separate standalone dispensing equipment for different production stages and reducing factory floor space occupation.

HSTECH offers two platform sizes: D450S standard single-track model and D1200S wide-format variant for large-size PCB substrates. Full technical parameters are outlined below:

Key industrial design highlights include SMEMA communication interface for seamless inline integration with SMT printers, placement machines, reflow ovens and AOI inspection equipment. Built-in CCD visual positioning automatically compensates substrate offset errors, while laser automatic height detection calibrates Z-axis height to adapt to warped PCBs, cutting manual adjustment downtime by over 70%. The high-temperature conveyor belt supports continuous hot-melt adhesive and high-viscosity epoxy dispensing, with vacuum nozzle cleaning to eliminate glue residue buildup and prevent nozzle blockage during long production runs.

Market research indicates jet dispensing equipment will maintain the fastest growth segment within the fluid control machinery industry, with piezoelectric jetting technology recording a 6.94% CAGR through 2031, driven by expanding demand for advanced 3D stacking, HBM and flip-chip packaging solutions in AI computing and automotive EV electronics. As a manufacturer founded in 2012, HSTECH Automation holds more than 10 new patents and over 5 software copyrights annually, building a complete product matrix covering dispensing machines, conformal coating equipment, inline coating AOI, UV/IR curing furnaces and full SMT peripheral automation equipment to deliver turnkey smart manufacturing production lines for global customers.

The D450S high speed dispenser is fully compatible with HSTECH’s self-developed P450S selective coating machine, inline coating AOI, UV curing furnace, elevator and flip conveyor, enabling one-stop full-line procurement for conformal coating and dispensing processes. All equipment complies with CE industrial safety standards and ISO9001 quality management systems, with global after-sales support covering Asia, Europe, North America and Southeast Asia EMS factories.

“Miniaturization and high precision are irreversible trends in electronic assembly, and traditional dispensing equipment can no longer satisfy the yield and efficiency demands of new-generation chips and flexible circuits," said HSTECH Automation Product Director. “Our D450S high speed dispensing machine integrates visual positioning, multi-valve compatibility and SMEMA inline connectivity into a cost-effective modular platform, allowing small and medium electronics manufacturers to upgrade precision dispensing capacity without excessive capital expenditure. We will continue to expand R&D investment in jet dispensing and intelligent fluid control technology to support global clients’ smart factory transformation."

Interested manufacturers can request machine operation videos, technical datasheets and factory trial testing service by contacting HSTECH’s global sales team via sales@hstech-smt.