For electronics manufacturers, component distributors and IC test houses, repackaging loose unordered SMT components has long been a persistent production headache. Conventional manual taping workflows consume significant manpower, and tweezers handling may scratch component surfaces or damage device outlines. Human operations also bring risks of miscounting, mis‑orientation and inconsistent sealing quality, which may trigger mounting failures on downstream SMT assembly lines. To resolve these industry bottlenecks, HSTECH has officially launched its new‑generation KRDA‑3C21C loose‑component sorting & carrier‑tape packaging machine, a standalone automation unit integrating gentle feeding, multi‑angle visual inspection, high‑speed pick‑and‑place, heat sealing and reel winding into one compact footprint.

Different from rigid bowl vibratory feeders that easily chip sensitive IC bodies, the KRDA‑3C21C adopts a flexible vibration platform paired with drawer‑type hopper for material supply. Loose chips are separated and oriented face‑up through resonance vibration without scratching or deforming components. Once materials on the working platform fall below preset level, the drawer‑style hopper automatically supplements stock, enabling non‑stop long‑duration production without frequent manual material refilling.

Vision capability defines the core reliability of this taping system. Five sets of industrial CCD cameras are deployed across different working stations to complete full‑dimensional monitoring. The top camera locates XY coordinates of scattered components and guides the placement head for accurate picking. Side‑axis, bottom and corner cameras jointly check component surface marking, bottom pin status, side profile, as well as cavity dimension A0 and B0 of carrier tape. Before cover‑tape sealing, the pre‑sealing camera will verify whether each pocket is filled correctly, filter empty positions, complete part counting, read component serial numbers, and support data docking with customer‑side MES systems to realize full‑process product traceability. Defective parts will be automatically diverted to the NG bin during running.

Users can choose either 4‑nozzle or 8‑nozzle ZR‑motion placement head based on output demands. Standard mistake‑proof SMT nozzles support fast replacement to adapt diverse IC package forms. The whole motion framework is built on servo‑driven gantry XYZ platform. Ground ball‑screw and high‑performance linear guides guarantee stable high‑speed movement, with placement accuracy controlled at ±0.05 mm.

The sealing assembly uses dual high‑conductivity copper sealing heads. Operators can fine‑tune inner‑outer sealing spacing within 8 mm‑44 mm with high‑precision micrometer knobs. Sealing repeatability reaches 0.05 mm, achieving CPK ≥1.0 peel strength performance; tape bursting, tearing and delamination are effectively avoided. Ratchet‑driven tape transport with 65‑hardness PU pressing wheel works well with PS, PC, ABS and PET carrier tapes. The take‑up mechanism is compatible with multiple reel specifications ranging from 7‑inch up to 24‑inch, satisfying various factory packaging standards.

Below is the consolidated core specification table for KRDA‑3C21C:

Target users cover IC distributors, EMS contract manufacturers, IC testing facilities and electronic R&D labs. It handles nearly all chip‑type SMT components that are hard for manual manipulation, and fits application scenarios including post‑test repackaging, bulk loose material re‑taping and small‑batch mixed‑component packaging.

“Many factories still rely heavily on manual labour for loose component taping. Apart from high operating costs, quality fluctuation becomes a hidden risk for subsequent SMT assembly. The KRDA‑3C21C is engineered to change this situation. Gentle feeding prevents component damage, multi‑camera inspection minimises bad‑reel outflow, and optional 8‑nozzle configuration brings obvious throughput improvement. MES connectivity further helps customers build digital component packaging workflows,” commented the HSTECH product team.

If you want to obtain formal quotation, application case references, demo video or sample test opportunities for KRDA‑3C21C, please feel free to reach out to our global sales team for further communication.